Semiconductor Alumina Ceramic Plate Kaviri Surface Kugaya Lapping Solution

Machine Model:  YH2M84100 Kaviri dhisiki Kukuya Lapping Machine

Workpiece:  Semiconductor Alumina Ceramic Plate-59*59* T 26.45mm

Chidimbu:  Flatness 0.003mm, Parallelism 0.007mm, Roughness Ra0.8μm;

Results:  Flatness≤0.001mm, Parallelism≤0.002mm，Ra0.8μm;

• Kushandiswa kukuru kwe semiconductor alumina ceramics:

    1. Electronic packaging substrate: inoshandiswa kuI IC packaging uye magetsi modules, nepamusoro yekudzivirira uye yakanaka thermal conductivity. 

    2. Chip holder: inopa mechanical support, insulation uye thermal stability. 

    3. Radiator zvinhu: inoshandiswa kune yakakwirira-simba midziyo yekuvandudza kupisa kupisa kuita. 

   4. Vacuum madivayiri uye masensa: anoshandiswa mukupisa kupisa kwepamusoro uye marara ekudzivirira nharaunda.

• Semiconductor alumina ceramic sheet pamusoro pekukuya uye polishing process zvinodiwa:

1.  Kukuya: Dhaimondi rinokuya vhiri rinodiwa kuti ive nechokwadi chepamusoro-chaiyo kugadzirwa kwezvinhu zvakanyanya-kuomarara uye kudzora flatness uye roughness.

2.  Polishing: Multi-nhanho yakanaka kugadzirisa kuti ive nechokwadi chekupedza uye kugadzirisa kune yakakwirira-chaiyo semiconductor application.

3. Dimension control: Nyatsodzora kushivirira kuti udzivise deformation yekupisa uye dimensional kutsauka kuti uve nechokwadi chekuenderana kwechigadzirwa.